Etchant for Au
AURUM series, etchant for Au and Pd has high wetness performance to create excellent pattern in the process of forming bump and wiring.
Product name | Features |
---|---|
AURUM-100 series | For general pattern |
AURUM-200 series | For fine pattern |
AURUM-300 series | For fine pattern Long bath life |
AURUM-400 series | For fine pattern |
AURUM-500 series | Etchant for stacked film |
AURUM-302 Bath life
AURUM-302 Wetness performance
AURUM-501 Post Etching pattern profile
- Etchant : AURUM-501
- Etching condition : Stirring, 25°C
- Wafer : Stacked Au/Ni film
Etchant for Transparent Conductive Film
Etchant for transparent conductive film which best suits fine patterning of ITO/IZO pixel electrode in FPD fabrication process.
Excellent removal performance of residue at the time of etching.
Product name | Etching objects | Features |
---|---|---|
ITO-02 | Poly-ITO, Amorphous-ITO | High etching rate |
ITO-06N | Amorphous-ITO, IZO | No post etching residue on Glass, SiO2, etc |
ITO-07N | No post etching residue SiNx, etc | |
ITO-101N | No post etching residue SiNx, etc. Little crystallization. |
Etchant for Stacked Film
Capable of etching stacked metal film at the same time.
Product name | Etching object |
---|---|
KSMF-100 series | stacked Mo/Al |
KSMF-200 series | stacked Ti/Al |
Post etching pattern profile
- Etchant : KSMF-240
- Etching condition : Stirring, 40°C, Just etching time x 1.5
- Etchant : KSMF-100
- Etching condition : Stirring, 40°C, Just etching time x 1.2
Etchant for Ag and Ag alloy
Suitable for Ag wiring and reflector of Touch panel , LCD and OLED.
SEA-5:Suitable for etching heat-resisting Ag alloy.
Product name | Features |
---|---|
SEA-1 | For dipping |
SEA-2 | For spray |
SEA-3 | For dipping, odor free |
SEA-4 | For dipping and spray |
Etching residue removal performance and pattern profile
- Etchant : SEA-2
- Etching condition : Stirring, 30°C, just etching time x 2
Etchant for Ag nanowire
Capable of etching Ag nanowire transparent conductive film.
Product name | Features |
---|---|
SEA-NW01 | Full etching |
SEA-NW02 | Partial etching |
Etchant for Cu
Etchant for Cu thin film.
Product name | Etching method |
---|---|
Cu-01 | For dipping |
Cu-02 | For dipping and spray |
Cu-03 |
Post etching pattern profile
- Etchant : Cu-03
- Etching condition : Stirring, Room temperature, Just etching time x 2
Etchant for Al
Capable of effective in fine patterning.
Available as Mo etchant as well.
Product name | Etching method |
---|---|
Al etchant | For dipping and spray |
Etchant for Cr
Best suits etching Cr thin film of photomask, quartz unit, surface acoustic wave filter etc. in fabrication process.
Product name | Etching method |
---|---|
Cr etchant | For dipping |
Etchant for Si
Alkali etchant for crystalline silicon.
Capable of inhibiting Fe,Ni and Cu impurities adsorption on the Si wafer.
Product name | Features |
---|---|
KOHLM | Ultra Pure Chemicals |
KOH-ULM | |
NaOHLM | |
NaOH-CX | Capable of inhibiting Fe, Ni and Cu impurities adsorption |
TMAH-22, TMAH-25 | Ultra Pure Chemicals |