Hard Gold Plating Solution

Aurexel FC
Capable of depositing hard gold film by non-cyanide plating solution.
Aurexel AM
Capable of forming Au-Ni alloy plating film with nano-level mixture of fine crystal and amorphous.

 

Electroless Gold Plating Solution for Forming Micro-bump

Aurexel MD

  • Capable of forming Au micro-bump on a pad with resist patterning.
  • Cyanide-free electroless Au plating solution with treating conditions of neutral pH and low temperature.
  • Suitable for embedding plating for Micro-via.

 

MICRO-BUMP INTERCONNECTION

  • PLATING CONDITION
    • Temperature : 50 ~ 60°C
    • Deposition rate (μm.hr) : 1~7
    • Die shear strength : OK
    • pH : 7.0 ~ 8.0
    • Hardness : under 90Hv
MICRO FABRICATION