- ⦿ NaOHLM-CX can suppress metal adsorption on the wafer during etching.
| Products | Composition | Features |
| 48%-potassium hydroxide solution | 48% KOH |
Low metal impurities High purity |
| 48%-sodium hydroxide solution | 48% NaOH |
Low metal impurities
High purity |
| NaOHLM-CX | NaOH with an additive |
For Si wafer
Low metal impurities Ultra high purity |
| NaOHLM | 48% NaOH |
For Si wafer
Low metal impurities Ultra high purity |
| TMAH-22 | 22% TMAH |
Low metal impurities
Ultra high purity |
| TMAH-25 | 25% TMAH |
Low metal impurities
Ultra high purity |
TMAH：Tetra Methyl Ammonium Hydroxide