for Cu/low-k
A low-temperature cleaning solution designed to effectively remove residues after dry etching and ashing, without causing damage to copper (Cu) or low-k dielectric films. Ideal for advanced semiconductor processes, it ensures high material compatibility and minimal corrosion risk.
| Product name | Removal target |
|---|---|
| DeerClean-LK1 | Cu residue |
| DeerClean-LK3 series | Cu residue, Si residue, Organic residue |
| DeerClean-LK4 | Cu residue, Organic residue |
The DeerClean-TRP series is an advanced post-etch residue remover formulated for high selectivity with cobalt (Co), enabling effective removal of etch residues while simultaneously cleaning metal hard masks. Ideal for next-generation semiconductor processes requiring precision and material integrity.
| Products | Selectivity | TiN etching rate （nm/min.） |
|---|---|---|
| DeerClean-TRP series | Cu、low-k、Co、AlOx | >10 |
for Al
Our post-etch residue removers are designed to quickly eliminate residues left after dry etching and ashing, delivering high cleaning efficiency at low temperatures. Ideal for advanced semiconductor processes, they help maintain material integrity while shortening process time.
| Products | pH | Applicable process |
|---|---|---|
| DeerClean-SA1v3 | Acidic | Al line |
| DeerClean-SA3 series | Acidic | Al line and via holes |
This advanced post-etching residue remover is formulated to safely eliminate both organic and metallic residues without damaging various metal materials. It is especially effective for removing heavy residue buildup after thick-film wiring pattern processes, such as those found in power device manufacturing. The formulation is free of hydroxylamine and NMP, making it a safer and more environmentally responsible choice.
| Products | Features | Selectivity | Processing time (min.) | Rinse |
|---|---|---|---|---|
| JELK-100series | Excellent metal corrosion protection and high selectivity for resins (Polyimide and PBO) | Al-Cu, SiN, SiO2, Ti, TiN, Cr, Co, Ni, Cu, GaN, Ag,IGZO, TaN, W, Au, and so on | 25～70 | Water |
| JELK-200series | Superior balance between stripping performance and corrosion protection performances | Water orIPA |