Our post-CMP (Chemical Mechanical Planarization) cleaning solutions are specially formulated to efficiently remove metallic impurities, particles, and organic residues left on wafers after CMP processes. Engineered for high selectivity and material compatibility, these solutions effectively clean without causing damage to metallic layers or interlayer dielectrics.
Ideal for use in advanced semiconductor manufacturing, these cleaners ensure surface integrity, minimize defects, and support high-yield production.
| Products | Applicable process | pH | Features |
|---|---|---|---|
| CMP-M02 | Cu-CMPW-CMP | Acidic | ・Standard acid cleaning solution・High metallic impurity removal performance |
| CMP-M200 series | W-CMP | Acidic | ・High organic residue removal performance・Also removes fine particles |
| CMP-B200 series | Cu-CMPCo-CMP | Alkaline | ・High organic residue removal performance・Applicable to a variety of barrier metals (Ta, Ti, Co, and Ru) |
| CMP-B300 series | STI-CMP, ILD-CMP | Acidic | ・High ceria slurry removal performance・Inhibits damage to dielectrics and W |
| CMP-ML series | Co-CMPMo-CMP | Mildly acidic –Mildly alkaline | ・High silica slurry removal performance |
| CMP-M302 | SiC-CMP | Acidic | ・High Mn-based slurry removal performance |
Our advanced wafer cleaning solutions are designed to remove metallic impurities and particles simultaneously, delivering superior cleaning performance in a single step. With minimal reattachment of metallic contaminants, these solutions help maintain wafer surface integrity while reducing total cleaning steps, leading to streamlined processes and lower operational costs.
Perfectly suited for modern semiconductor fabs aiming for efficiency, reliability, and yield enhancement.
| Products | Applicable wafer | pH |
|---|---|---|
| Frontier Cleaner-A01 | Si-based wafer | Acidic: Organic acid |
| Frontier Cleaner-A02 | Si-based wafer | Acidic: Inorganic acid |
| Frontier Cleaner-B01 | Si-based wafer | Alkaline |
| Frontier Cleaner-A05 | SiC, GaN wafer | Acidic |
EZ-01A is a high-performance cleaning solution specially formulated for the semiconductor industry. It is designed to effectively remove adhesive residue left behind after the peeling of dicing and back-grinding tapes. Its optimized formulation ensures thorough cleaning without compromising sensitive materials commonly found in semiconductor devices.
- Cost-Effective Usage: Can be diluted with water at high ratios, making it an economical solution without compromising performan
- Superior Adhesive Removal: Effectively removes residual adhesives from wafers following dicing and back grinding processes, ensuring a clean and contamination-free surface.
- Excellent Material Compatibility: Causes minimal to no damage to critical materials such as copper (Cu) electrodes and insulating films, preserving device integrity.
- High Safety Profile:
- Low toxicity
- Low hazard classification
- Non-flammable
- Easy and safe to handle in cleanroom environments
- Cost-Effective Usage: Can be diluted with water at high ratios, making it an economical solution without compromising performance.
- Environmentally Friendly: Designed with sustainability in mind, EZ-01A meets modern safety and environmental standards for industrial cleaning agents.
| Products | pH | Dilution ratio |
|---|---|---|
| EZ-01A | Alkaline | ～100 times |
Our specialized cleaning solutions are distillable and regenerable, offering an efficient and sustainable method for removing low molecular weight organic EL (Electroluminescent) materials. These solutions are specifically engineered to thoroughly clean metal masks, jigs, and various components used in the organic EL (OLED) manufacturing process, where material adhesion is common.
| Products | Recommended rinse agent | Distillation and regeneration |
|---|---|---|
| OEL Clean-01 | Hydro Fluoro Ether | Possible |
| OEL Clean-03 | Hydro Fluoro Ether | Possible |
Our advanced cleaning solutions are eco-conscious formulations designed to deliver superior removal of particles and organic contaminants from glass substrates used in high-precision industries such as display panel manufacturing, optical devices, and semiconductor applications.
| Products | pH | Cleaning target |
|---|---|---|
| CLEA 635N | Alkaline | Particles, organic residue |
| CLEA 6035N | Alkaline | Particles, organic residue |