Aurexel DP

Aurexel DP is a high-performance, cyanide-free immersion gold (Au) plating solution designed for applications requiring reliable surface finishes on Ni-P (nickel-phosphorus) films. It enables the formation of a dense, uniform gold thin film with excellent solder wettability and consistent precipitation uniformity, making it ideal for advanced electronic and semiconductor components.

  • Cyanide-free formulation – safer and more environmentally responsible
  • Form dense and uniform Au film on Ni-P substrate
  • Excellent solder wettability for improved assembly performance
  • Superior film consistency and surface appearance
  • Suitable for applications in PCBs, connectors, and semiconductor packages
Products Temperature(℃) pH Features
Aurexel DP 50~60 7.0~7.1 Cyanide-free
Aurexel MD

Aurexel MD is an advanced electrolytic gold plating solution engineered for high-performance applications in electronics, semiconductors, and precision components. Developed by Kanto Corporation, it ensures exceptional purity (99.99% Au), superior adhesion, and unmatched corrosion resistance, making it ideal for demanding industrial environments.

  • Cyanide-free electroless Au plating solution and capable of forming micro-bumps.
  • Capable of treating conditions of neutral pH and low temperature, and excellent operability and safety.
  • Capable of embedding and via sidewall thick plating.
  • Au plating speed is 2μm/hr, and its hardness is 80~90Hk.
Products Temperature(℃) pH Features
Aurexel MD 50~60 7.0~7.5 Cyanide-free
Aurexel FC
  • Cyanide-free hard Au plating solution for electrodeposition.
  • Good resistance to mechanical wear is obtained by slightly containing Ni in the Au film.
  • Less hardness variation caused by heat treatment.
  • The appearance of the film is lemon yellow.
Products Ni content(wt%) Hardness(Hk) Features
Aurexel FC-103 0.03 200 Solution temperature 30℃ pH 7.5 Cyanide-free
Aurexel FC-104 0.5 240