JELK series
This specialized stripper is capable of removing stubborn resists and dry film resists remaining after ion implantation—materials that are typically difficult to strip using conventional amine-based solutions. Free of hydroxylamine and NMP, this product offers a safer, more environmentally friendly alternative without compromising performance.
After treatment
After treatment
| Products | Features | Selectivity | Processing temperature （℃） | Rinse |
|---|---|---|---|---|
| JELK-100 series | Excellent selectivity with metals and resins such as polyimide | Al-Cu, SiN, SiO2, Ti, TiN, Cr, Co, Ni, Cu, GaN, Ag, IGZO, TaN, W, Au, etc. | 25～70 | Water |
| JELK-200 series | Superior balance between stripping performance and corrosion protection performances | Water or IPA | ||
| JELK-400 series | Compatible with ultrasonic processes | |||
| JELK-500 series | For stripping dry film resist Supports fine patterns | SiN, SiO2, Ti, TiN, Cr, Ni, Cu, TaN, Au, etc | Water |
TMK series／TMA series
The TMK Series is a developer designed for positive-type photoresists, formulated without TMAH (tetramethylammonium hydroxide), a highly toxic substance. This eco-friendly and safer alternative delivers high performance in developing processes while supporting environmental compliance and workplace safety.
| Products | Features |
|---|---|
| TMK series | TMAH-free |
| TMA-508 | 2.38%TMAH |