Gold Etchant Iodine-based etchant capable of selectively etching Au.
Silver Etchant Mixed Acid is designed for etching Ag and Ag alloys. 
Cooper Etchant Hydrogen peroxide-based etchant designed for selective etching of Cu or etching of Cu/T
Ruthenium Etchant Acid type etchant to etch RuO2.
Chromium Etchant Acid type etchant.
Aluminium Etchant An acid-based etchant for Mo/Al or Ti/Al stacked films. Etching for single-layer Al films also possible.
Titanium Etchant Hydrogen peroxide-based etchant suitable for Ti, TiW, and TiN.
ITO Etchant Poly ITO etchant.
Nickel Etchant Acid type type etchant for Ni sputtered film also possibility to etch Cu for reworking the substrate.
Metal Oxide Etchant Acid type etchant for IGZO.
Silicon Etchant Etchant can suppress metal adsorption on the wafer during etching.
Pizzoelectric Thin Film Etchant Acid type etchant for PZT (lead zirconate titanate) film and etchant for thin KNN (potassium sodium niobate) film.